On May 14, 2026, Beijing MAKES participated in the Beijing CEIA Electronic Intelligent Manufacturing Seminar

The conference site showcased the infrared focused repair technology and through-hole device repair system, while simultaneously unveiling the independently developed fully automated intelligent image acquisition system and chip coplanarity detection system. With robust product capabilities, it attracted numerous clients for in-depth technical exchanges, creating a lively atmosphere at the event. The conference achieved a resounding success.